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Polyhedral Oligomeric Silsesquioxanes (POSS)

HENGDA-Glycidyl POSS - Octakis(glycidyloxypropyl) Polyhedral Oligomeric Silsesquioxane

HENGDA-Glycidyl POSS

Glycidyl POSS (EP-POSS) is a hybrid molecule featuring an inorganic silsesquioxane core with organic glycidyl groups attached at the corners of the cage. While most of the cages had a (SiO₁.₅)₈ core, some cages with a (SiO₁.₅)₁₀ or (SiO₁.₅)₁₂ core were also present.
With its unique 3D cage structure (~1.5nm) and reactive epoxy groups, it significantly enhances mechanical properties, thermal stability and interfacial adhesion in polymer matrices, making it widely used in epoxy resin modification, composites, and adhesive development.
*This product is co-developed and jointly produced with Shenzhen Institute for Advanced Polymer Materials (SIAP).

  • Chemical Name:

    Octakis(glycidyloxypropyl) Polyhedral Oligomeric Silsesquioxane

  • CAS No.

    68611-45-0

Typical Properties

PropertyDescription
Chemical NameOctakis(glycidyloxypropyl) Polyhedral Oligomeric Silsesquioxane
CAS Number68611-45-0
Molecular Formula(C3H5O)8Si8O12
Molecular Weight~1177 g/mol
Density~1.2 g/cm³
Epoxy Equivalent Weight~167
AppearanceClear, colorless viscous liquid
Viscosity (25°C)4 – 6 Pa·s
Solubility

Soluble in chloroform, toluene, THF; slightly soluble in ethanol; insoluble in

water

Thermal StabilityStable up to ~300°C (5% weight loss, TGA data)
Purity≥ 98.0%


Applications

The key characteristic of EP-POSS is its glycidyl epoxy groups, which are highly reactive and capable of undergoing ring-opening reactions with amines, anhydrides, or other curing agents, making it an excellent crosslinking agent or modifier in polymer systems. It exhibits strong compatibility with epoxy resins, polyurethanes, and other thermosetting polymers, where it enhances material properties such as thermal stability (up to ~300–350°C), mechanical strength, toughness, and adhesion, while reducing curing shrinkage.

Epoxy Resin Modification: Improves toughness, heat resistance, and mechanical strength of epoxy resins, suitable for electronic encapsulation materials. Composites: Enhances interfacial bonding and high-temperature resistance in fiber-reinforced composites, applicable in aerospace industries.

Adhesives: Used to formulate high-strength, weather-resistant adhesives for bonding metals and plastics.

Note: This document does not contain the product safety information necessary for safe use. Prior to handling, please review the product and material safety data sheets along with hazard information. To obtain material safety data information, reach out to SIAP.


Storage

Keep away from fire and direct sunlight.

Store in a cool, dry, and well-ventilated area, away from direct sunlight and high temperatures.

It has 12 months shelf life in closed containers.

Recommended storage temperature: 5°C - 25°C.

Avoid contact with strong acids, bases, or amines (to prevent premature epoxy reaction).

Products beyond the shelf life can be usable, if quality check passed.


Packing

Standard Packaging: 100 g/bottle, 500 g/bottle, 1 kg/bottle, 5 kg/drum, 25 kg/drum.

Packaged in sealed containers; custom packaging available upon request.


HENGDA-Glycidyl POSS