Epoxycyclohexyl POSS (EPC-POSS) is an organic-inorganic hybrid nanomaterial featuring a silsesquioxane cage core with epoxycyclohexyl functional groups attached to its corners. Most of the cages had a (SiO₁.₅)₈ core, some cages with a (SiO₁.₅)₁₀ or (SiO₁.₅)₁₂ core were also present.
Its unique molecular structure provides excellent thermal stability, mechanical properties, and chemical compatibility, making it ideal for enhancing polymer material performance.
*This product is co-developed and jointly produced with Shenzhen Institute for Advanced Polymer Materials (SIAP).
Epoxycyclohexyl Polyhedral Oligomeric Silsesquioxane
329360-71-6
| Property | Description |
| Chemical Name | Epoxycyclohexyl Polyhedral Oligomeric Silsesquioxane |
| Molecular Formula | (C₈H₁₃O₂)₈Si₈O₁₂ |
| CAS Number | 329360-71-6 |
| Molecular Weight | ~1418 g/mol |
| Appearance | Clear, colorless viscous liquid or semi-solid |
| Viscosity (25 oC) | 500 – 600 mPa-s |
| Density | ~1.2 g/ml |
| Refractive index | 1.52 |
| Epoxy Equivalent Weight | ~177 g/eq |
| Solubility | Soluble in THF, chloroform, isopropanol; insoluble in hexane |
| Purity | ≥ 98.0% |
The epoxy groups of EP302 enable it to participate in crosslinking reactions with amines, acids, or photoinitiators, making it highly versatile for polymer systems. It is compatible with epoxy resins, acrylics, and other thermosetting materials, where it acts as a reactive additive or co-monomer. Thus, EP302 is widely utilized in materials science and engineering applications, when incorporated into polymer matrices, epoxycyclohexyl POSS enhances properties such as thermal stability (up to ~350–400°C), mechanical strength, hardness, and solvent resistance, while maintaining optical clarity and reducing shrinkage during curing.
Coatings: Used as a toughening agent in cationic-cured coatings, improving high-temperature resistance and water resistance.
Composites: Enhances mechanical strength and thermal stability of epoxy resins, suitable for aerospace applications.
Adhesives: Improves adhesion to various substrates, applicable in electronic encapsulation.
Note: This document does not contain the product safety information necessary for safe use. Prior to handling, please review the product and material safety data sheets along with hazard information. To obtain material safety data information, reach out to SIAP.
Keep away from fire and direct sunlight.
Store in a cool, dry, and well-ventilated area, away from direct sunlight and high temperatures.
It has 12 months shelf life in closed containers.
Recommended storage temperature: 5°C - 25°C.
Avoid contact with strong acids, bases, or amines (to prevent premature epoxy reaction).
Products beyond the shelf life can be usable, if quality check passed.
Standard Packaging: 100 g/bottle, 500 g/bottle, 1 kg/bottle, 5 kg/drum, 25 kg/drum.
Packaged in sealed containers; custom packaging available upon request.
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